SPhotonix is working towards commercializing its 5D optical "memory crystal" technology that uses lasers to write nanoscale data into durable fused‑silica glass. One 5‑inch disc can hold 360TB. The ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling ...
Broadcom Inc. has announced the availability of its 3.5D eXtreme Dimension system-in-package (XDSiP) platform technology to develop next-generation custom AI accelerators (XPUs), claiming breakthrough ...
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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules
Broadcom has introduced its 3.5D eXtreme Dimension System in Package (3.5D XDSiP) platform for ultra-high-performance processors for AI and HPC workloads. The new platform relies on TSMC's CoWoS and ...
We recently compiled a list of the 10 Buzzing AI Stocks Making Headlines. In this article, we are going to take a look at where Broadcom Inc. (NASDAQ:AVGO) stands against the other buzzing AI stocks.
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