Broadcom Inc. has announced the availability of its 3.5D eXtreme Dimension system-in-package (XDSiP) platform technology to develop next-generation custom AI accelerators (XPUs), claiming breakthrough ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
A new technical paper titled “Leveraging 3D Technologies for Hardware Security: Opportunities and Challenges” was published by researchers at the University of California, Santa Barbara and Columbia ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
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