The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...
Diamfab and other start-ups want to commercialize diamond wafers for demanding chip applications such as data centers, ...
NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims can reshape ...
The German wafer manufacturer said the efficiency was achieved with an unspecified M6 HJT commercial production line, without specifying if the result was certified by an independent third party.
As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...
Researchers from Norway and Germany investigated the influence of impurities in fused quartz crucibles used in silicon PV ingot production. The results suggest that the key factors influencing ...
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