Plastic is a vital material for modern healthcare applications because of its versatility. Its uses have continued to evolve along with this dynamic industry. However, this can present some ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The “composites for sustainable mobility” (CosiMo) project was launched in 2018 by Faurecia Clean Mobility (Nanterre, France) to develop a smart thermoplastic composite resin transfer molding (RTM) ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...

NEW YORK, June 25, 2026 /PRNewswire/ -- rePurpose Global, the world's leading Packaging Compliance and Sustainability Platform, today announced the launch of the Packaging Simulator, a ...