A new supply-chain report suggests that Apple is seeking to be an early player in what some believe will be the next big thing in chip development: printed circuit boards (PCBs) made from glass ...

TSMC is expanding its work on glass substrates as it prepares for future advanced packaging needs in high-performance ...

A collaboration between the groups of Professor Mónica H. Pérez-Temprano at the Institute of Chemical Research of Catalonia (ICIQ) and Professor Anat Milo at Ben-Gurion University of the Negev has ...

In a significant advancement for sustainable industrial practices, a team of international researchers have conducted a systematic review, uncovering 299 alternative substrates across 12 industries ...

"Customers have secured both chips and packaging, but they are left scrambling because they can't get substrates." LG Innotek ...

The increasing global demand for renewable energy has underscored the importance of optimizing solar energy systems. Solar panels, particularly monocrystalline solar panels, are among the most ...

Why it matters: AMD may not manufacture its own chips anymore, but that hasn't stopped it from investing in research and custom process technologies for its chips. Now, the company has its sights on ...

A specialized glass layer could make tomorrow’s computers faster and more energy efficient. Human-made glass is thousands of years old. But it’s now poised to find its way into the AI chips used in ...

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

Endoplasmic reticulum-associated degradation (ERAD) plays indispensable roles in many physiological processes; however, the nature of endogenous substrates remains largely elusive. Here we report a ...

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...